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Электронный каталог: Ishikawa, M. - Copper Process Solutions. New SIS Technology for 70nm-Generation Device in Cu Interconnection
Ishikawa, M. - Copper Process Solutions. New SIS Technology for 70nm-Generation Device in Cu Interconnection
Книга (аналит. описание)
Автор: Ishikawa, M.
Perspective technologies, materials and equipments of solid-state electronic components: Copper Process Solutions. New SIS Technology for 70nm-Generation Device in Cu Interconnection
б.г.
ISBN отсутствует
Автор: Ishikawa, M.
Perspective technologies, materials and equipments of solid-state electronic components: Copper Process Solutions. New SIS Technology for 70nm-Generation Device in Cu Interconnection
б.г.
ISBN отсутствует
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Книга (аналит. описание)
Ishikawa, M.
Copper Process Solutions. New SIS Technology for 70nm-Generation Device in Cu Interconnection / M. Ishikawa // Perspective technologies, materials and equipments of solid-state electronic components : proc. of II russian-japanese seminar (6 April, 2004. Moscow) / ed. L. V. Kozhitov . – M. : MISA Publ., 2004 . – P. 71-77 .
Ishikawa, M.
Copper Process Solutions. New SIS Technology for 70nm-Generation Device in Cu Interconnection / M. Ishikawa // Perspective technologies, materials and equipments of solid-state electronic components : proc. of II russian-japanese seminar (6 April, 2004. Moscow) / ed. L. V. Kozhitov . – M. : MISA Publ., 2004 . – P. 71-77 .
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Книга
Perspective technologies, materials and equipments of solid-state electronic components: proc. of II russian-japanese seminar (6 April, 2004. Moscow)
MISA Publ., 2004 г.
ISBN 5-87623-132-0
Библиотека МИСиС : Научный
Perspective technologies, materials and equipments of solid-state electronic components: proc. of II russian-japanese seminar (6 April, 2004. Moscow)
MISA Publ., 2004 г.
ISBN 5-87623-132-0
Библиотека МИСиС : Научный